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  4. Carrier-Envelope Offset Stabilized Ultrafast Diode-Pumped Solid-State Lasers
 
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Carrier-Envelope Offset Stabilized Ultrafast Diode-Pumped Solid-State Lasers

Auteur(s)
Schilt, Stéphane
Editeur(s)
Südmeyer, Thomas 
Institut de physique 
In
Applied Sciences, MDPI, 2015/5/4/787-816
Mots-clés
  • optical frequency com...

  • carrier-envelope offs...

  • modelocked laser

  • diode-pumped solid-st...

Résumé
Optical frequency combs have been revolutionizing many research areas and are finding a growing number of real-world applications. While initially dominated by Ti:Sapphire and fiber lasers, optical frequency combs from modelocked diode-pumped solid-state lasers (DPSSLs) have become an attractive alternative with state-of-the-art performance. In this article, we review the main achievements in ultrafast DPSSLs for frequency combs. We present the current status of carrier-envelope offset (CEO) frequency-stabilized DPSSLs based on various approaches and operating in different wavelength regimes. Feedback to the pump current provides a reliable scheme for frequency comb CEO stabilization, but also other methods with faster feedback not limited by the lifetime of the gain material have been applied. Pumping DPSSLs with high power multi-transverse-mode diodes enabled a new class of high power oscillators and gigahertz repetition rate lasers, which were initially not believed to be suitable for CEO stabilization due to the pump noise. However, this challenge has been overcome, and recently both high power and gigahertz DPSSL combs have been demonstrated. Thin disk lasers have demonstrated the highest pulse energy and average power emitted from any ultrafast oscillator and present a high potential for the future generation of stabilized frequency combs with hundreds of watts average output power.
URI
https://libra.unine.ch/handle/123456789/6829
DOI
10.3390/app5040787
Autre version
http://dx.doi.org/10.3390/app5040787
Type de publication
Resource Types::text::journal::journal article
Dossier(s) à télécharger
 main article: Schilt_S.-Carrier-Enveloppe-20151016.pdf (2.15 MB)
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