Relation between substrate surface morphology and microcrystalline silicon solar cell performance

In the present paper, the structural and electrical performances of microcrystalline silicon (μc-Si:H) single junction solar cells co-deposited on a series of substrates having different surface morphologies varying from V-shaped to U-shaped valleys, are analyzed. Transmission electron microscopy (TEM) is used to quantify the density of cracks within the cells deposited on the various substrates. Standard 1 sun, variable illumination measurements (VIM) and Dark <i>J</i>(<i>V</i>) measurements are performed to evaluate the electrical performances of the devices. A marked increase of the reverse saturation current density (<i>J</i>₀) is observed for increasing crack densities. By introducing a novel equivalent circuit taking into account such cracks as non-linear shunts, the authors are able to relate the magnitude of the decrease of <i>V</i>_oc and FF to the increasing density of cracks.